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New fabrication process enables inexpensive production of complex, highly-articulated mechanical devices at the millimeter scale



Technology:
Monolithic fabrication process:

Markets Addressed


The invented monolithic fabrication process enables low-cost production of complex, highly-articulated mechanical devices and functional machine components at the millimeter-scale - a capability not achievable using conventional manufacturing methods.

The fabrication of functional mechanical devices on the millimeter scale is a critical capability in fields such as autonomous microrobots and micromanipulation devices, and is important in the manufacture active components for technologies such as optical switches and smart antennas. However, available manufacturing technologies in MEMS and conventional machining lack the versatility, precision, and cost-efficiency to produce large quantities of functional devices on this scale. The present invention addresses this need through a series of process innovations which enable the monolithic fabrication of functional, three-dimensional mechanisms from a superplanar stack of precisely patterned material layers. This technology has direct applications to the mass production of autonomous robots, including service and hobby robots, and the manufacture of micromanipulation devices and other articulated millimeter-scale machines.

Innovations and Advantages


Unlike bulk fabrication methods used in MEMS and conventional machining, the invented process allows the use of a wide variety of materials, including alloyed metals, polymers, and carbon fiber sheets, to create complicated kinematic linkages, support structures, and assembly-assist features on a single millimeter–scale manufacturing layup. This process also affords the integration of full subcomponents such as motors, ICs, and batteries into devices during the fabrication process. The invented process employs low-cost, low-power operations such as laser micromachining, press lamination, and origami-inspired folding techniques to greatly reduce assembly expense and increase process scalability.

Here is an example of a structure that can be built using this technique:

Additional Information


Additional Resources:
Harvard Microrobotics Laboratory



Inventor(s):
    Sreetharan, Pratheev S.
    Whitney, John Peter
    Wood, Robert J.

Categories:
For further information, please contact:
Sam Liss, Director of Business Development
(617) 495-4371
Reference Harvard Case #4059