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Tin and lead compound precursors for low temperature atomic layer deposition (ALD)



Technology:
Tin and lead cyclic amides

Markets Addressed


The growth of microelectronic devices, inexpensive displays, and devices that require thin films has increased the need for new methods for depositing thin layers of specialized materials on a range of substrates. Because of their unique combination of high conductivity and optical transparence, tin compounds thin films are essential components of the new generations of smart flat panel displays, organic light emitting diodes (OLED), and gas sensors.

The invention presented concerns novel precursors for the deposition of tin and lead, and tin and lead oxides, sulfides, nitrides, etc. on a variety of substrates using atomic layer deposition (ALD). Most ALD processes require high growth temperatures (500˚C) to operate properly. The material presented here can be deposited at temperatures as low as 50˚C with extremely high purity, smoothness, and uniformity. The material properties can also be adjusted to give the deposited layer specific properties, including high conductivity, optical transparency, and semiconductor properties.

These attributes make this technology an excellent choice for a diverse range of applications. The low temperature of deposition allows for the technology to be used on plastics and other thermally sensitive materials. Therefore, this process can be used to coat LED/OLED devices, displays, and solar cells. The range of material properties makes this method also desirable for microelectronics, photodetectors, gas sensors, electron multipliers, and piezo-electric devices.

Innovations and Advantages


This invention offers novel materials comprising cyclic amides of tin and lead and new methods for depositing cyclic amides containing tin or lead on a variety of substrates using atomic layer deposition (ALD). The combination of ALD and these materials allows for the creation of thin layers of tin or lead compounds with desirable properties. For example, the deposition process yields extremely uniform and smooth coatings that can conform to holes or trenches in the substrate (good step coverage). These materials can also be deposited with high purity and can be transparent and or highly electrically conductive, depending on the composition of the deposited material. In addition to acting as a conductor, the material can also act as a semiconductor if doped with another material, such as aluminum. One of the most significant advantages of these materials is that they can be deposited with ALD temperatures as low as 50˚C. This means that the cyclic amides can be deposited on thermally sensitive substrates such as plastic, allowing for conductive and transparent layers to applied on devices such as displays and solar cells.

Additional Information


Intellectual Property Status: Patent application has been filed by Harvard University and is pending.



Inventor(s):
    Gordon, Roy G.
    Heo, Jaeyeong
    Hock, Adam
    Sinsermsuksakul, Prasert

Categories:
For further information, please contact:
Mick Sawka, Director of Business Development
(617) 496-3830
Reference Harvard Case #3708