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Available Technology

Highly conformal tungsten nitride films for use in microelectronics and semiconductors



Technology:
Method of producing a uniform, smooth and conformal coating of tungsten nitride

Markets Addressed


Suitable applications in microelectronics include barriers to the diffusion of copper and electrodes for thin film capacitors and field-effect transistors (FETs). Similar processes deposit molybdenum nitride, which is suitable for layers alternating with silicon in x-ray mirrors. Other markets addressed include
Atomic Layer Deposition and use in semiconductors.

Innovations and Advantages


The invention describes a method of producing a uniform, smooth and conformal coating of tungsten nitride, synthesized by atomic layer deposition (ALD). The silver-colored coating (or film) is metallic and a good electrical conductor.

Additional Information


Intellectual Property Status: Issued U.S. patent nos.: 7,560,581





Inventor(s):
    Becker, Jill
    Gordon, Roy G.
    Suh, Seigi

Categories:
For further information, please contact:
Mick Sawka, Director of Business Development
(617) 496-3830
Reference Harvard Case #2086