Highly conformal tungsten nitride films for use in microelectronics and semiconductors
Method of producing a uniform, smooth and conformal coating of tungsten nitride
Suitable applications in microelectronics include barriers to the diffusion of copper and electrodes for thin film capacitors and field-effect transistors (FETs). Similar processes deposit molybdenum nitride, which is suitable for layers alternating with silicon in x-ray mirrors. Other markets addressed include
Atomic Layer Deposition and use in semiconductors.
Innovations and Advantages
The invention describes a method of producing a uniform, smooth and conformal coating of tungsten nitride, synthesized by atomic layer deposition (ALD). The silver-colored coating (or film) is metallic and a good electrical conductor.
Intellectual Property Status: Issued U.S. patent nos.: 7,560,581
Gordon, Roy G.
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Mick Sawka, Director of Business Development
Reference Harvard Case #2086